Title: Hollow cavity package electronic unit

Abstract: A method of assembling split, hollow package sections housing an electronic element, having an internal lead wire and having external lead wires extending outwardly therefrom, wherein the package sections are adhesively secured together with external lead wires interposed between the mating surfaces by a fibrous sheet carried by the mating surface of the base portion with the sheet impregnated with a partially-cured plastic polymer.

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Inventors: Mizutani, Kazunori (Ibaragi, JA)
Kitaura, Toshihiko (Ibaragi, JA)
Noo, Minoru (Ibaragi, JA)

Application Number: 499955
Filing Date: 1974-08-23
Publication_date: 1976-03-16
Assignee: Nitto Electric Industrial Co., Ltd. (Ibaragi, JA)
Primary Class(es): 29/854 156/330, 174/52.4, 257/699, 257/E23.189, 257/E23.193, 438/118
Other Classes:
US Patent Ref:

3435516	Apr, 1969	Kilby	29/588.
3606677	Sep, 1971	Ryan	156/330.
3768157	Oct, 1973	Buie	29/588.
3810816	May, 1974	Zachariades	156/330.

Other Refs:
Primary Examiner: Tupman, W.
Assistant Examiner:
Attorney: Sughrue, Rothwell, Mion & Zinn