Title: Thermoelectric assembly and thermoelectric couples and subcouples therefor

Abstract: A thermoelectric assembly including a plurality of N-type and P-type semiconductor bodies interconnected by junction bridge elements. The junction bridge elements are in the form of thin sheets or plates of conductive material disposed edgewise with respect to the bodies and connected thereto by means of lips or tabs which extend perpendicular to the plane of the junction bridge element. A frame for directly engaging and holding the junction bridge elements and heat dissipating and absorbing means cooperate with the edges of the bridge elements.

Do you think this is a good invention? Vote now:

Votes so far: For:(0) Against:(0)
Other info:

Inventors: Elfving, Sven T.
Elfving, Thore M. (San Mateo, CA, US)

Application Number: 533258
Filing Date: 1974-12-16
Publication_date: 1976-03-09
Assignee:
Primary Class(es): 136/211 136/212, 136/225
Other Classes:
US Patent Ref:

3379577	Apr, 1968	Bird	357/28.
3392439	Jul, 1968	Sonnenschein	357/28.
3411955	Nov, 1968	Weiss	357/28.
3524771	Aug, 1970	Green	357/28.
3531330	Sep, 1970	Elfving	357/28.

Other Refs:
Primary Examiner: Miller, Jr., Stanley D.
Assistant Examiner: Wojciechowicz, E.
Attorney: Flehr, Hohbach, Test, Albritton & Herbert