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Title: Method for high temperature semiconductor processing

Abstract: A method for high temperature processing in device fabrication wherein multi-processing steps are performed in the absence of subjecting the unit to ambient conditions.


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Inventors: Ing, Paul W. (Poughkeepsie, NY, US)

Application Number: 486555
Filing Date: 1974-07-08
Publication_date: 1976-03-09
Assignee: International Business Machines Corporation (Armonk, NY)
Primary Class(es): 438/762 438/770, 438/910
Other Classes:
US Patent Ref:
3571914Mar, 1971Lands et al.148/188.
3615942Dec, 1971Blumenfeld et al.148/187.
3793090Feb, 1974Barile et al.148/1.

Other Refs:
Primary Examiner: Ozaki, G.
Assistant Examiner:
Attorney: Powers; Henry