Title: Semiconductor wafer baking and handling system

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Abstract: A semiconductor wafer baking and handling system includes a pair of wheel assemblies each comprising a pair of spaced apart plates having opposed, aligned slots formed therein for receiving and supporting semiconductor wafers. A wafer transporting air track includes portions extending between the plates of both of the wheel assemblies. The wheel assemblies are rotated about axes lying substantially in the plane of and extending perpendicularly to the path of wafer travel along the air track to sequentially position the slots to receive semiconductor wafers, to rotate the received semiconductor wafers through an arc of 180.degree., and to subsequently sequentially position the slots to effect removal of the semiconductor wafers. One of the wheel assemblies is mounted in a housing which also encloses a heater, a fan, and baffles for directing gas from the fan across the heater and across the wafers to effect baking of the wafers. The other wheel assembly is maintained at room temperature and functions as a temporary storage and inverting apparatus for the wafers.


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