Title: Methods of solid-phase bonding mating members through an interposed pre-shaped compliant medium

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Abstract: Methods of producing consistently uniform and high strength solid-phase (preferably thermocompression) bonds between two mating members and, in particular, between multiple micro-size lead-frame-fabricated electrical ribbon leads and thin film terminals formed on glass or ceramic circuit substrates, for example, through the utilization of at least one, but preferably two or more, interposed and specially contoured compliant contacts per lead. The pre-shaping of the compliant contacts into essentially triangular cross-section (preferably accomplished by initially roll bonding contact-forming precious metal wire(s) to lead-frame forming strip stock), has been found to be very beneficial and significant in establishing a sufficient degree of inherent compliancy to minimize, if not eliminate, force-induced circuit substrate failures due to fracture or glass cavitation, and to provide sufficient plastic deformation to insure the attainment of reliable and consistent mechanical cleaning, metal-to-metal adhesion and bond definition at the bond interfaces. The utilization of two or more pre-shaped compliant contacts per bond area, so as to produce redundant bonds, further insures against total bond and/or substrate failures due to the presence of random micro-imperfections in or blemishes on the mating bond surfaces.


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