Title: Method of manufacturing semiconductor device and resulting product

Abstract: In sealing at least a semiconductor element portion of a semiconductor device by the use of a resin, the semiconductor element is covered with a stabilizer or with a resin containing the stabilizer. The stabilizer is adapted to check the migration of a mobile substance such as hydrochloric acid and a mobile ion such as chlorine ion existent within the resin. Owing to the fixation of the ion, the electrical characteristics of the semiconductor device are prevented from being degraded, and constituent parts in the semiconductor device are prevented from being corroded.

Do you think this is a good invention? Vote now:

Votes so far: For:(0) Against:(0)
Other info:

Inventors: Wakashima, Yoshiaki (Kawasaki, JA)
Suzuki, Hiroshi (Hitachi, JA)

Application Number: 446792
Filing Date: 1974-02-28
Publication_date: 1976-02-17
Assignee: Hitachi, Ltd. (JA)
Primary Class(es): 257/786 174/52.2, 252/511, 252/519.21, 252/589, 257/790, 257/791, 257/792, 257/793, 257/E23.126, 264/272.17, 438/127
Other Classes:
US Patent Ref:

3533965	Oct, 1970	Ikeda et al.	357/72.
3653959	Apr, 1972	Kehr et al.	357/72.
3684592	Aug, 1972	Chang et al.	357/72.
3696263	Oct, 1972	Wacher	357/72.
3700497	Oct, 1972	Epifano et al.	357/72.
3749601	Jul, 1973	Tittle	357/72.
3756872	Sep, 1973	Goodman	357/72.

Other Refs:
Primary Examiner: James, Andrew J.
Assistant Examiner:
Attorney: Craig & Antonelli