Title: Process for the double-sided exposure of a semiconductor or substrate plates, especially wafers, as well as apparatus for the purpose of parallel and rotational alignment of such a plate

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Abstract: The invention concerns a process for the two-sided exposure of a semiconductor or substrate plate, especially exposure of a wafer, through exposure masks which are arranged in plane parallel, parallel and rotational alignment to either side of a semiconductor plate. The invention further concerns an apparatus for parallel and rotational alignment to either side of a semiconductor plate. The invention further concerns an apparatus for parallel and rotational alignment of a semiconductor or substrate plate, especially alignment of a wafer, in relation to two exposure masks, operating on either of the two surfaces of the semiconductor or substrate plate, for the purpose of a two-sided exposure, in accord with the process established by the invention. An adjustable wedge-error correction head is provided supporting the semiconductor or substrate plate, for plane parallel adjustment of one surface, preferably the top one, of the semiconductor or substrate plate relative to the first exposure mask, also preferably the upper one, and an apparatus for bringing into contact the other surface of the semiconductor or substrate plate, preferably the lower one, relative to the second exposure mask, also preferably the lower one. A rotational compound slide table is provided, arranged in a plane parallel to the first exposure mask and displaying a mask mounting support for same, for the plane parallel position calibration of the first exposure mask relative to the semiconductor or substrate plate and to a microscope-type viewing device.


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