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Primary Examiner: James, Andrew J.
Assistant Examiner:
Attorney: Rundle; William W., Graham; Willard M.

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Title: Heat conductive mounting and connection of semiconductor chips in micro-circuitry on a substrate

Abstract: Integrated circuit chips are mounted in electronic assemblies with the chip terminal pads "up" or on the opposite side of the chip from the substrate of the circuit board. The lower chip surface is bonded either directly to the heat-conducting substrate or through an intermediate pedestal of a good heat-conducting volume of metal. Beam leads from the integrated circuit terminals are bonded to relatively large heat-conductive posts acting as spacers, if necessary, between the beam leads and the circuitry pattern.

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Inventors: Grossman, Norman J. (Malibu, CA, US)
Linder, Jacques F. (Palos Verdes Peninsula, CA, US)

Application Number: 479410
Filing Date: 1974-06-14
Publication_date: 1976-02-03
Assignee: Northrop Corporation (Los Angeles, CA)
Primary Class(es): 257/717 174/16.3, 257/705, 257/E23.101
Other Classes:
US Patent Ref:

3414775	Dec, 1968	Melan et al.	357/80.
3487541	Jan, 1970	Boswell	357/80.
3568012	Mar, 1971	Ernst	357/80.
3594619	Jul, 1971	Kamoshida	357/81.
3670404	Jun, 1972	Kamoshida	357/81.
3684818	Aug, 1972	Netherwood	357/80.
3805375	Apr, 1974	Lacombe et al.	357/72.
3846824	Nov, 1974	Bell	357/81.

Other Refs: Other References: Electronics; Al Gets Around, p. 38, Dec. 22, 1969.