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Title:
Method of making a compound semiconductor layer of high resistivity
Abstract:
A method is provided for making a semiconductor layer having a high resistivity comprising the steps of implanting ions into a semiconductor comprising gallium and arsenic at a first acceleration voltage at a concentration higher than the limit of solid solubility of said ions in said semiconductor, the ions being of a material which forms a deep energy level in said semiconductor; implanting protons into said semiconductor at an acceleration voltage less than said first acceleration voltage; and then heating the semiconductor, for example, from 300.degree.C to 700.degree.C.
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Inventors:
Shinoda, Daizaburo (Tokyo, JA)
Application Number:
436802
Filing Date: 1974-01-25 Publication_date: 1976-02-03 Assignee:
Nippon Electric Company Limited (Tokyo, JA)
Primary Class(es):
438/520
257/E21.34, 257/E21.542, 438/403, 438/522
Other Classes:
US Patent Ref:
Other Refs:
Primary Examiner:
Rosenberg, Peter D.
Assistant Examiner:
Attorney:
Hopgood, Calimafde, Kalil, Blaustein and Lieberman
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