Title: Method of producing a semiconductor arrangement

Abstract: A method of producing a semiconductor arrangement comprises electrolytically depositing a thickening onto a metal layer, at the contact points for the semiconductor arrangement, which metal layer is intended to eventually form conducting paths for the semiconductor arrangement and effectively covers the relevant semiconductor body surface.

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Inventors: Botzenhardt, Leonhard (Heilbronn, DT)

Application Number: 453881
Filing Date: 1974-03-22
Publication_date: 1976-02-03
Assignee: Licentia Patent-Verwaltungs-G.m.b.H. (Frankfurt am Main, DT)
Primary Class(es): 438/613 257/750, 257/E21.175, 438/614, 438/678
Other Classes:
US Patent Ref:

3495324	Feb, 1970	Guthrie	29/578.
3556951	Jan, 1971	Cerniglia	29/578.

Other Refs:
Primary Examiner: Tupman, W.
Assistant Examiner:
Attorney: Spencer & Kaye