Title: Multiface wire bonding method and tool

Abstract: A conductive wire is bonded to spaced parts of a semi-conductor device by an ultrasonic bonding wedge that is formed with side-by-side bonding faces of mutually different inclinations. One of the faces makes a forward bond having a lesser deformation at an inner end of the bond. The other of the bond faces is employed to make a rear bond in which a greater deformation is made at an outer end of the bond to facilitate parting of the wire at the second bond. A wire guide movably mounted adjacent the bonding wedge laterally shifts the wire from one bond face to the other.

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Inventors: Larrison, John E. (Costa Mesa, CA, US)

Application Number: 510416
Filing Date: 1974-09-30
Publication_date: 1976-01-27
Assignee:
Primary Class(es): 228/110.1 228/1.1, 257/E21.518
Other Classes:
US Patent Ref:

3347442	Oct, 1967	Reber	228/3.
3627192	Dec, 1971	Killingsworth	228/1.
3648354	Mar, 1972	Mashino	29/470.

Other Refs:
Primary Examiner: Smith, Al Lawrence
Assistant Examiner: Joyce, Margaret
Attorney: Rothenberg; Allan