Title: Method of fabricating metal printed wiring boards

Abstract: An additive process for producing printed wiring boards is taught. In the process metal substrates having desired hole patterns are powder coated with a dielectric material electrostatically. The dielectric powder coating is then fused on the metal substrate. Next, a continuous film of pre-catalyzed adhesive is applied to all surfaces; then a plating resist is applied to all areas on which copper is not desired. The exposed catalyzed adhesive is then activated and plated in an electroless copper bath.

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Inventors: Hanni, Stephen L. (Richardson, TX, US)

Application Number: 461072
Filing Date: 1974-04-15
Publication_date: 1976-01-27
Assignee: Texas Instruments Incorporated (Dallas, TX)
Primary Class(es): 29/846 53/430, 53/442, 174/254, 174/256, 174/266, 361/779, 427/97.2, 427/470, 427/476
Other Classes:
US Patent Ref:

3294951	Dec, 1966	Olson	29/626.
3334395	Aug, 1967	Cook et al.	174/68.
3488913	Jan, 1970	Burgess	53/30.
3558441	Jan, 1971	Chadwick et al.	204/15.
3600875	Aug, 1971	Buob et al.	53/30.
3610811	Oct, 1971	O'Keefe	29/626.
3673680	Jul, 1972	Tanaka et al.	29/626.
3698940	Oct, 1972	Mesereau et al.	204/30.
3704208	Nov, 1972	Russo	204/30.
3745095	Jul, 1973	Chadwick et al.	174/68.
3778532	Dec, 1973	Braden	29/626.

Other Refs:
Primary Examiner: Lanham, C. W.
Assistant Examiner: Walkowski, Joseph A.
Attorney: Levine; Harold, Grossman; Rene E., Bandy; Alva H.