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Title: Heat sink casing for circuit board components

Abstract: A case containing and supported on a channel like bracket that divides the case into two chambers. A first chamber contains the signal processing circuitry. The second chamber contains the power circuitry. The power transistors are mounted on the main wall of the bracket, in the second chamber, so that the bracket acts as a heat sink. The bracket has side walls which extend along inner walls of the case in good thermal contact therewith to provide heat conduction. A variable resistor faces out an opening in the top of the case to permit used adjustment of the timing constant. The resistor is mechanically supported on an edge of the bracket to prevent the resistor being pushed into the case while being adjusted.


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Inventors: Horbach, Stephen (Mountain Lakes, NJ, US)

Application Number: 539870
Filing Date: 1975-01-09
Publication_date: 1976-01-20
Assignee:
Primary Class(es): 361/709 361/825
Other Classes:
US Patent Ref:
3328642Jun, 1967Haumesser317/100.
3569788Mar, 1971Niblack317/101.
3699394Oct, 1972Schuler317/100.
3816911Jun, 1974Knappenberger317/101.
3873889Mar, 1975Leyba317/101.

Other Refs:
Primary Examiner: Tolin, Gerald P.
Assistant Examiner:
Attorney: Ryder, McAulay, Fields, Fisher & Goldstein