|
|

|
|
Title:
Melamine, formaldehyde, thiourea and diol ether thermosetting resin and method of preparing the same
Abstract:
A thermosetting resin useful for attaching decorative paper facings to chipboard and like cellulosic panels is prepared by condensation of melamine with thiourea, formaldehyde, and a diol ether, up to one half by weight of the melamine being capable of being replaced by urea without seriously effecting the quality of the resin.
Do you think this is a good invention? Vote now:
Votes so far: For:(0) Against:(0) Other info:
Inventors:
Michaud, Horst (Trostberg, DT) Seeholzer, Josef (Trostberg, DT) Pentzel, Ludwig (Tacherting, DT) Mangs, Josefa (Trostberg, DT)
Application Number:
472152
Filing Date: 1974-05-22 Publication_date: 1976-01-20 Assignee:
Suddeutsche Kalkstickstoff-Werke AG (Trostberg, DT)
Primary Class(es):
524/598
428/530
Other Classes:
US Patent Ref:
Other Refs:
Primary Examiner:
Schain, Howard E.
Assistant Examiner:
Attorney:
Berman; Hans
|
|

|