Title: Thermosetting resin composition

Abstract: A thermosetting resin composition consisting essentially of (1) a prepolymer having a thermal vinyl group, prepared by reacting (a) a polyepoxide compound with at least one equivalent, per epoxy group of said polyepoxide compound, of (b) a dicarboxylic acid half ester having the formula: ##SPC1## Wherein R is ##EQU1## in which n is an integer of 1 to 4 and X is H or CH.sub.3, and R' is a divalent aliphatic group having 2 to 6 carbon atoms or a divalent aromatic radical having 6 or 7 carbon atoms; and (2) a vinyl monomer copolymerizable therewith.

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Inventors: Takamori, Shigeru (Osaka, JA)
Morimoto, Eizi (Wakayama, JA)
Sakaguchi, Kahei (Wakayama, JA)

Application Number: 526109
Filing Date: 1974-11-22
Publication_date: 1976-01-13
Assignee: Kao Soap Co., Ltd. (Tokyo, JA)
Primary Class(es): 525/502 525/529, 525/531, 525/922, 526/75, 526/318, 528/107, 528/112, 528/365
Other Classes:
US Patent Ref:

3066112	Nov, 1962	Bowen	260/837.
3150118	Sep, 1964	Clemens	260/78.
3179623	Apr, 1965	Bowen	260/837.
3367992	Feb, 1968	Bearden	260/837.
3632861	Jan, 1972	Hargis	260/837.
3670047	Jun, 1972	Broecker	260/837.
3810826	May, 1974	Mani	260/837.

Other Refs:
Primary Examiner: Lieberman, Paul
Assistant Examiner:
Attorney: Woodhams, Blanchard and Flynn