Title: Device and method of wire wrap (or other electrical interconnection between I.C. sockets) checkout

Abstract: This invention is directed to a test module for and method of testing integrated circuit connections (i.e., wire wrap, multilayer printed circuit boards, etc.) to determine whether or not the circuits are correctly wired and whether or not there are any short circuits or broken connections, as well as any other electrical problems. The system confirms the validity of the electrical interconnections by a visual comparison of the lighted light emitting diodes and the assembly plan; if the correct comparison is not made, an error in the manufacturing process is indicated. Failure of any of the expected light emitting diodes to light indicates missing or electrically bad connections; extra lighted light emitting diodes indicate extraneous connections or short circuits on the board.

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Inventors: Curtis, Jr., Ralph W. (Lanham, MD, US)
Byrne, William P. (Burke, VA, US)
Pezzulich, Alan G. (Alexandria, VA, US)

Application Number: 525251
Filing Date: 1974-11-19
Publication_date: 1976-01-06
Assignee:
Primary Class(es): 324/556 324/537
Other Classes:
US Patent Ref:

2977530	Mar, 1961	Cook	324/51.
3348138	Oct, 1967	Palmentiero	324/73.
3439268	Apr, 1969	Gregory et al.	324/51.

Other Refs:
Primary Examiner: Rolinec, R. V.
Assistant Examiner: Karlsen, Ernest F.
Attorney: Sciascia; R. S., Branning; Arthur L., Crane; Melvin L.