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Title: Printed circuit board and method of preparing it
Abstract:
A printed circuit board is prepared by connecting electronic components to the circuit, coating the board with a layer up to about 0.1 mil thick of a compound of the formula C.sub.n F.sub.2n.sub.+1 C.sub.m X.sub.2m.CHY--OOC--C(R)=CH.sub.2 or its prepolymer, replacing at least one of the electronic components, thermally bonding another electronic component to the circuit, and recoating the area around the new component with a layer of the compound or its prepolymer. In the formula n is 2 to 9, m is 1 to 9, X and Y are H, F Cl, or Br and R is --H or --CH.sub.3. This method enables a printed circuit board to be easily repaired since the coating on the board can be soldered or welded through without first removing the coating or protecting the surrounding coating.
Other info: Inventors: Sprengling, Gerhard R. (Blairsville, PA, US) Application Number: 298213 Filing Date: 1972-10-17 Publication_date: 1976-01-06 Assignee: Westinghouse Electric Corporation (Pittsburgh, PA) Primary Class(es): 174/254 29/841, 174/256, 228/176, 264/272.17, 361/779 Other Classes: US Patent Ref:
Other Refs: Other References: Licari and Brands, "Organic Coatings," Machine Design, May 25, 1967, pp. 176-194. | |