Title: Temperature compensated acoustic surface wave device

Abstract: A temperature compensated acoustic surface wave device, such as a surface wave delay line is provided in which temperature compensation is provided by the deposition of an interdigital electrode structure on a substrate with an overlay film surface of piezoelectric material of a predetermined thickness. A double substrate arrangement is also disclosed in which the interdigital electrode structure is deposited upon the surface of a non-piezoelectric layer which in turn is placed upon the surface of a piezoelectric substrate.

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Inventors: Schulz, Manfred B. (Sudbury, MA, US)
Holland, Melvin G. (Lexington, MA, US)

Application Number: 359801
Filing Date: 1973-05-14
Publication_date: 1976-01-06
Assignee: Raytheon Company (Lexington, MA)
Primary Class(es): 427/100 257/416, 257/417, 427/258, 427/271, 427/331
Other Classes:
US Patent Ref:

3347703	Oct, 1967	Engelman et al.	117/217.
3385731	May, 1968	Weimer	117/212.
3388002	Jun, 1968	Foster	117/217.
3409464	Nov, 1968	Shiozawa	117/217.
3469120	Sep, 1969	Nagao et al.	117/217.
3573960	Apr, 1971	Duncan	117/217.

Other Refs:
Primary Examiner: Weiffenbach, Cameron K.
Assistant Examiner:
Attorney: Inge; John R., Pannone; Joseph D., Bartlett; Milton D.